Manufacturer Part#: | CY62157DV30LL-55ZSXI |
Product Category: | Memory |
Manufacturer: | Cypress Semiconductor Corp |
Description: | IC SRAM 8MBIT 55NS 44TSOP |
CY62157DV30LL-55ZSXI  Datasheet | |
Package: | 44-TSOP (0.400", 10.16mm Width) |
Quantity: | 1200 PCS |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
one to seven days | |
Click buy button to purchase: | Buy |
CAD Models
CY62157DV30LL-55ZSXI Footprint
Product Attributes
Manufacturer | Cypress Semiconductor Corp |
Product Category | Memory |
Series | MoBL® |
Brand | Cypress Semiconductor Corp |
Package / Case | 44-TSOP (0.400", 10.16mm Width) |
Packaging | Tray |
Package Shape | Rectangular |
Package Body Material | PLASTIC/EPOXY |
Package Style | SMALL OUTLINE, THIN PROFILE |
Package Code | TSOP2 |
Package Equivalence Code | TSOP44, 46, 32 |
Pin Pitch | 0.8 mm |
Length | 18.415 mm |
Width | 10.16 mm |
Mounting Type | Surface Mount |
Mounting Style | SMD/SMT |
Memory Width | 16 |
Memory Size | 8 M (512 K x 16) |
Memory Density | 8388608.0 bit |
Memory Interface | Parallel |
Memory Type | Volatile |
Memory Format | RAM |
Memory IC Type | Standard SRAM |
Technology | SRAM - Asynchronous |
Moisture Sensitivity Level | 3 |
Number of ports | 1 |
Number of Functions | 1 |
Number of Reflow Cycle | 3 |
Number of Terminations | 44 |
Number of Words | 524288.0 words |
Number of Words Code | 512 K |
Address Bus Width | 19 b |
JESD-30 Code | R-PDSO-G44 |
JESD-609 Code | e4 |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Min | -40°C |
Operating Temperature-Max | +85°C |
Organization | 512KX16 |
Output Characteristics | 3-STATE |
Application | Cellular Telephones |
Parallel/Serial | PARALLEL |
Product Type | SRAM |
Peak Reflow Temperature | 260 °C |
Reflow Solder Time | 30 Sec |
Subcategory | SRAMs |
I/O Type | COMMON |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Nickel / Palladium / Gold |
Terminal Form | Gull Wing |
Terminal Position | Dual |
Seated Height-Max | 1.194 mm |
Standby Current-Max | 4.0E-6 Amp |
Standby Voltage-Min | 1.5 V |
Supply Voltage-Nom | 3.0 V |
Supply Voltage – Min | 2.2 V |
Supply Voltage - Max | 3.6 V |
Supply Current-Max | 0.015 Amp |
Write Cycle Time - Word, Page | 55 ns |
Access Time-Max | 55 ns |
Lead Finish(Plating) | Au |
Under Plating Material | Pd over Ni |
Terminal Base Material | Cu |
ECCN | 3A991.b.2.a |
HTSUSA | 8542320041 |
Features
• Temperature Ranges
— Industrial: –40°C to 85°C
— Automotive-A: –40°C to 85°C
— Automotive-E: –40°C to 125°C
• Very high speed: 45 ns
• Wide voltage range: 2.20V–3.60V
• Pin-compatible with CY62157CV25, CY62157CV30, and CY62157CV33
• Ultra-low active power
— Typical active current: 1.5 mA @ f = 1 MHz
— Typical active current: 12 mA @ f = fmax
• Ultra-low standby power
• Easy memory expansion with CE1, CE2, and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Available in Pb-free and non Pb-free 48-ball FBGA, 44-pin TSOPII, and Pb-free 48-pin TSOPI
Overview
The CY62157DV30 is a high-performance CMOS static RAM organized as 512K words by 16 bits. This device features advanced circuit design to provide ultra-low active current. , This is ideal for providing More Battery Life, (MoBL ) in portable applications such as cellular telephones.The device also has an Automatic power-down feature that significantly reduces power consumption. The device CAN also be put into standby mode when deselected (CE HIGH or CE LOW or 1 2 both BHE and BLE are HIGH). The input/output pins (I/O 0 through I/O ) are placed in a high-impedance state when: 15 deselected (CE HIGH or CE LOW), outputs are disabled (OE 1 2 HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or during a write operation (CE 1 LOW, CE HIGH and WE LOW). 2 By Cypress Semiconductor Corp.
Advantages and Disadvantages
There is no relevant information available for this part yet.
Compliance
Lead-Free Status | Lead Free |
RoHS | Compliant |
Product Manufacturer
Cypress Semiconductor Corporation is an American semiconductor design and manufacturing company. It offers NOR flash memories, F-RAM and SRAM Traveo microcontrollers, and is the only PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters are in San Jose, California, and it has operations in the United States, Ireland, India and the Philippines. Some of its main competitors include Microchip Technology, NXP, Renesas and Micron. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom's Wireless Internet of Things Business.
Product Range
Wireless | Universal Serial Bus (USB) | Touch Sensing (CapSense) |
Microcontrollers (MCUs) | Power Management ICs | Memory |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 1200 | Cypress Semiconductor Corp | SRAM - Asynchronous Memory IC 8Mb (512K x 16) Parallel 55ns 44-TSOP II |
DigiKey | 0 | Cypress Semiconductor Corp | IC SRAM 8M PARALLEL 44TSOP II |
Mouser | 0 | Cypress Semiconductor | SRAM |
Alternative Models
There is no relevant information available for this part yet.
Popularity by Region
CY62157DV30LL-55ZSXI Popularity by Region
Market Price Analysis