• The Sino-US comparison in Information TechnologyPage Browsing:1956

    IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...

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  • New Materials Selection Has Been an TrendPage Browsing:1496

    Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...

    Jul 26,2018
  • Common Guide for Selecting Electronic ComponentsPage Browsing:1583

    Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule  We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule  It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization .    c、Purchasing Rule  The component...

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  • List of Integrated Circuit Packaging TypesPage Browsing:2688

    Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...

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  • Why do Internet Giants Want to Self-develop Chips?Page Browsing:2136

    IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...

    Jul 21,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MC56F8245VLD Company:NXP / Freescale Remark:IC MCU 16BIT 48KB FLASH 44LQFP Package:44-LQFP
MC56F8245VLD  Datasheet
In Stock:765
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PMEG3030EP-115 LM3S9B90-IQC80-C5 Company:Texas Instruments Remark:IC MCU 32BIT 256KB FLASH 100LQFP Package:LQFP-100
LM3S9B90-IQC80-C5  Datasheet
In Stock:2320
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PMEG3030EP-115 MC9S08QD4CSC Company:NXP Remark:IC MCU 8BIT 4KB FLASH 8SOIC Package:SOIC8
MC9S08QD4CSC  Datasheet
In Stock:41393
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PMEG3030EP-115 MC9S12GC64MFUE Company:NXP Remark:IC MCU 16BIT 64KB FLASH 80QFP Package:80-QFP
MC9S12GC64MFUE  Datasheet
In Stock:4926
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PMEG3030EP-115 MRF373ALR1 Company:FREESCALE Remark:RF Mosfet LDMOS 32V 200mA 860MHz 18.2dB 75W NI-360 Package:TO-63
MRF373ALR1  Datasheet
In Stock:85
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PMEG3030EP-115 MR82C54 Company:NTERSIL Remark: Package:CLCC
MR82C54  Datasheet
In Stock:455
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PMEG3030EP-115 MC9S08QA2CFQE Company:NXP Remark:IC MCU 8BIT 2KB FLASH 8QFN Package:8-VDFN Exposed Pad
MC9S08QA2CFQE  Datasheet
In Stock:25275
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PMEG3030EP-115 MAX6805US26D3+T Company:Maxim Integrated Remark:IC RESET MPU LOW PWR SOT143-4 Package:TO-253-4, TO-253AA
MAX6805US26D3+T  Datasheet
In Stock:4060
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PMEG3030EP-115 D2TO035CR0500FTE3 Company:Vishay Sfernice Remark:RES SMD 0.05 OHM 1% 35W TO263 Package:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
D2TO035CR0500FTE3  Datasheet
In Stock:70
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PMEG3030EP-115 MC56F82743VLC Company:NXP / Freescale Remark:IC MCU 32BIT 64KB FLASH 32LQFP Package:N/A
MC56F82743VLC  Datasheet
In Stock:83
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