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The Sino-US comparison in Information TechnologyPage Browsing:1956
IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...
Aug 4,2018 -
New Materials Selection Has Been an TrendPage Browsing:1496
Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...
Jul 26,2018 -
Common Guide for Selecting Electronic ComponentsPage Browsing:1583
Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization . c、Purchasing Rule The component...
Jul 25,2018 -
List of Integrated Circuit Packaging TypesPage Browsing:2688
Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...
Jul 24,2018 -
Why do Internet Giants Want to Self-develop Chips?Page Browsing:2136
IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...
Jul 21,2018
Ordering & Quality
Photo | Mfr. Part # | Company | Description | Package | Qty | MC56F8245VLD | Company:NXP / Freescale | Remark:IC MCU 16BIT 48KB FLASH 44LQFP | Package:44-LQFP |
MC56F8245VLD Datasheet |
In Stock:765 Inquiry |
Inquiry | LM3S9B90-IQC80-C5 | Company:Texas Instruments | Remark:IC MCU 32BIT 256KB FLASH 100LQFP | Package:LQFP-100 |
LM3S9B90-IQC80-C5 Datasheet |
In Stock:2320 Inquiry |
Inquiry | MC9S08QD4CSC | Company:NXP | Remark:IC MCU 8BIT 4KB FLASH 8SOIC | Package:SOIC8 |
MC9S08QD4CSC Datasheet |
In Stock:41393 Inquiry |
Inquiry | MC9S12GC64MFUE | Company:NXP | Remark:IC MCU 16BIT 64KB FLASH 80QFP | Package:80-QFP |
MC9S12GC64MFUE Datasheet |
In Stock:4926 Inquiry |
Inquiry | MRF373ALR1 | Company:FREESCALE | Remark:RF Mosfet LDMOS 32V 200mA 860MHz 18.2dB 75W NI-360 | Package:TO-63 |
MRF373ALR1 Datasheet |
In Stock:85 Inquiry |
Inquiry | MR82C54 | Company:NTERSIL | Remark: | Package:CLCC |
MR82C54 Datasheet |
In Stock:455 Inquiry |
Inquiry | MC9S08QA2CFQE | Company:NXP | Remark:IC MCU 8BIT 2KB FLASH 8QFN | Package:8-VDFN Exposed Pad |
MC9S08QA2CFQE Datasheet |
In Stock:25275 Inquiry |
Inquiry | MAX6805US26D3+T | Company:Maxim Integrated | Remark:IC RESET MPU LOW PWR SOT143-4 | Package:TO-253-4, TO-253AA |
MAX6805US26D3+T Datasheet |
In Stock:4060 Inquiry |
Inquiry | D2TO035CR0500FTE3 | Company:Vishay Sfernice | Remark:RES SMD 0.05 OHM 1% 35W TO263 | Package:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
D2TO035CR0500FTE3 Datasheet |
In Stock:70 Inquiry |
Inquiry | MC56F82743VLC | Company:NXP / Freescale | Remark:IC MCU 32BIT 64KB FLASH 32LQFP | Package:N/A |
MC56F82743VLC Datasheet |
In Stock:83 Inquiry |
Inquiry |