• Product
  • Article
Home > News

24

List of Integrated Circuit Packaging Types

Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wires through the contacts on the chip, and these pins are connected to other devices by wires on the printed circuit board to combine the internal chip with the external circuits. This is all because the chip must be isolated from the outside to prevent the chip circuits from corrosion and performance-decline due to the contact with air impurities.

On the other hand, the packaged chip is also easier to install and transport. It is crucial because the quality of the packaging directly affects the performance of the chip itself and the design & manufacture of the PCB (printed circuit board) to which it is connected.

An important indicator to measure the advancement of a chip packaging technology is the ratio of chip area to package area, and the closer this ratio is to 1 the better.

FIG.1.png

BGA

Ball Grid Array

FIG.2.png

QFP

Quad Flat Package

FIG.3.png

EBGA 680L

FIG.4.png

TQFP 100L

FIG.5.png

LBGA 160L

FIG.6.png

SC-70 5L

FIG.7.png

PBGA 217L

Plastic Ball Grid Array

FIG.8.png

SDIP

FIG.9.png

SBGA 192L

FIG.10.png

SIP

Single Inline Package

FIG.11.png

TSBGA 680L

FIG.12.png

SO

Small Outline Package

FIG.13.png

CLCC

FIG.14.png

SOJ 32L

FIG.15.png

CNR

Communication and Networking Riser Specification Revision 1.2 

FIG.16.png

SOJ

FIG.17.png

SOP EIAJ TYPE II 14L

FIG.18.png

CPGA

Ceramic Pin Grid Array

FIG.19.png

SOT-220

FIG.20.png

DIP

Dual Inline Package 

FIG.21.20180723.png

SSOP 16L

FIG.22.20180723.png

DIP-tab

Dual Inline Package with Metal Heatsink

FIG.23.20180723.png

SSOP

FIG.24.20180723.png

FBGA

FIG.25.20180723.png

TO-18

FIG.26.20180723.png

FDIP

FIG.27.20180723.png

TO-220

FIG.28.20180723.png

FTO-220

FIG.29.20180723.png

Flat Pack

FIG.30.20180723.png

TO-247

FIG.31.20180723.png

HSOP-28

FIG.32.20180723.png

TO-264

FIG.33.20180723.png

ITO-220

FIG.34.20180723.png

TO-3

FIG.35.20180723.png

ITO-3p

FIG.36.20180723.png

TO-5

FIG.37.20180723.png

JLCC

FIG.38.20180723.png

TO-52

FIG.39.20180723.png

LCC

FIG.40.20180723.png

TO-71

FIG.41.20180723.png

LDCC

FIG.42.20180723.png

TO-72

FIG.43.20180723.png

LQFP

FIG.44.20180723.png

TO-78

FIG.45.20180723.png

TO8

FIG.46.20180723.png

PCDIP

FIG.47.20180723.png

PGA

Plastic Pin Grid Array 

FIG.48.20180723.png

TO-92

FIG.49.20180723.png

TO-39

FIG.50.20180723.png

PLCC

FIG.51.20180723.png

TO-99

FIG.52.20180723.png

PQFP

FIG.53.20180723.png

TSOP

Thin Small Outline Package

FIG.54.20180723.png

PSDIP

FIG.55.20180723.png

LQFP 100L

FIG.56.20180723.png

TSSOP or TSOP II

Thin Shrink 

FIG.57.20180723.png

METAL QUAD 100L

FIG.58.20180723.png

uBGA

Micro Ball Grid Array

FIG.59.20180723.png

PQFP 100L

FIG.60.20180723.png

uBGA

Micro Ball Grid Array

FIG.61.20180723.png

QFP

Quad Flat Package

FIG.63.20180723.png

SOT-220

FIG.64.20180723.png

ZIP

Zig-Zag Inline Package

FIG.65.20180723.png

SOT-223

FIG.66.20180723.png

SOT-223

FIG.67.20180723.png

C-Bend Lead 

FIG.68.20180723.png

SOT-23

FIG.69.20180723.png

CERQUAD

Ceramic Quad Flat Pack

FIG.70.20180723.png

SOT-23/SOT-323

FIG.71.20180723.png

Ceramic Case

FIG.72.20180723.png

SOT-25/SOT-353

FIG.73.20180723.png

LAMINATE CSP 112L

Chip Scale Package

FIG.74.20180723.png

SOT-26/SOT-363

FIG.75.20180723.png

Gull Wing Leads

FIG.76.20180723.png

SOT-343

FIG.77.20180723.png

LLP 8La

FIG.78.20180723.png

SOT-523

FIG.79.20180723.png

SOT89

FIG.81.20180723.png

SOT-89

FIG.85.20180723.png

LAMINATE TCSP 20L

Chip Scale Package

FIG.80.20180723.png

PCI 32bit 5V

Peripheral Component Interconnect

FIG.82.20180723.pngPCI 64bit 3.3V
FIG.89.20180723.png

SIMM30

Single In-line Memory Module

FIG.92.20180723.png

SIMM72

Single In-line Memory Module

FIG.96.20180723.png

SLOT 1

For intel Pentium II Pentium III & Celeron CPU

FIG.98.20180723.png

SLOT A

For AMD Athlon CPU

FIG.83.20180723.png

Socket 603

Foster

FIG.84.20180723.png

PCMCIA

FIG.86.20180723.png

PDIP

FIG.87.20180723.png

PLCC

FIG.88.20180723.png

TO-252

FIG.90.20180723.png

TO-263/TO-268

FIG.91.20180723.png

SO DIMM

Small Outline Dual In-line Memory Module

FIG.93.20180723.png

SOCKET 370

For intel 370 pin PGA Pentium III & Celeron CPU

FIG.95.20180723.png

SOCKET 423

For intel 423 pin PGA Pentium 4 CPU

FIG.97.20180723.png

SOCKET 462/SOCKET A

For PGA AMD Athlon & Duron CPU

FIG.99.20180723.png

SNAPTK

FIG.100.20180723.png

SOCKET 7

For intel Pentium & MMX Pentium CPU

FIG.101.20180723.png

SNAPTK

FIG.102.20180723.png

SNAPZP

FIG.103.20180723.png

SOH

You may also like:

Why do Internet Giants Want to Self-develop Chips?

Bipolar Junction Transistor|BJT Transistor Theory

MOSFET Gate Drive Circuit Guidelines - Hints & Tips

Simple Analog Circuit Examples for Electronic Engineers

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 73M2R010F Company:CTS Electronic Components Remark:RES SMD 0.01 OHM 1% 2W 2512 Package:2512 J-Lead
73M2R010F  Datasheet 		In Stock:1263
Inquiry		 Inquiry
PMEG3030EP-115 ADSP-BF533SBBCZ500 Company:Analog Devices Remark:IC DSP CTLR 16B 500MHZ 160CSPBGA Package:BGA
ADSP-BF533SBBCZ500  Datasheet 		In Stock:1258
Inquiry		 Inquiry
PMEG3030EP-115 K9K8G08UOE-SCB0 Company:samsung Remark: Package:tsop
K9K8G08UOE-SCB0  Datasheet 		In Stock:5500
Inquiry		 Inquiry
PMEG3030EP-115 MC68CK16Z1CAG16 Company:NXP Remark:IC MCU 16BIT 144LQFP Package:144-LQFP
MC68CK16Z1CAG16  Datasheet 		In Stock:18655
Inquiry		 Inquiry
PMEG3030EP-115 DSS16-01AS Company:IXYS Remark:DIODE SCHOTTKY 100V 16A TO263AB Package:TO-263-3, D²Pak (2 Leads + Tab), TO-
DSS16-01AS  Datasheet 		In Stock:580
Inquiry		 Inquiry
PMEG3030EP-115 PIC12F675-E/MF Company:Microchip Remark:IC MCU 8BIT 1.75KB FLASH 8DFNS Package:8-VDFN Exposed Pad
PIC12F675-E/MF  Datasheet 		In Stock:94
Inquiry		 Inquiry
PMEG3030EP-115 LFE2-6SE-5FN256C Company:Lattice Semiconductor Remark:IC FPGA 190 I/O 256BGA Package:256-BGA
LFE2-6SE-5FN256C  Datasheet 		In Stock:270
Inquiry		 Inquiry
PMEG3030EP-115 MPC5123YVY400B Company:NXP Remark:IC MCU 32BIT 516FPBGA Package:516-BBGA
MPC5123YVY400B  Datasheet 		In Stock:104
Inquiry		 Inquiry
PMEG3030EP-115 MCF51JE256CLK Company:NXP Remark:IC MCU 32BIT 256KB FLASH 80LQFP Package:80-LQFP
MCF51JE256CLK  Datasheet 		In Stock:2091
Inquiry		 Inquiry
PMEG3030EP-115 MAX6315US31D3+T Company:Maxim Integrated Remark:IC RESET CIRCUIT 3.08V SOT143-4 Package:TO-253-4, TO-253AA
MAX6315US31D3+T  Datasheet 		In Stock:13364
Inquiry		 Inquiry
Copyright © 2017-2021 • Kynix Semiconductor Limited • All Rights Reserved