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List of Integrated Circuit Packaging Types

Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wires through the contacts on the chip, and these pins are connected to other devices by wires on the printed circuit board to combine the internal chip with the external circuits. This is all because the chip must be isolated from the outside to prevent the chip circuits from corrosion and performance-decline due to the contact with air impurities.

On the other hand, the packaged chip is also easier to install and transport. It is crucial because the quality of the packaging directly affects the performance of the chip itself and the design & manufacture of the PCB (printed circuit board) to which it is connected.

An important indicator to measure the advancement of a chip packaging technology is the ratio of chip area to package area, and the closer this ratio is to 1 the better.

FIG.1.png

BGA

Ball Grid Array

FIG.2.png

QFP

Quad Flat Package

FIG.3.png

EBGA 680L

FIG.4.png

TQFP 100L

FIG.5.png

LBGA 160L

FIG.6.png

SC-70 5L

FIG.7.png

PBGA 217L

Plastic Ball Grid Array

FIG.8.png

SDIP

FIG.9.png

SBGA 192L

FIG.10.png

SIP

Single Inline Package

FIG.11.png

TSBGA 680L

FIG.12.png

SO

Small Outline Package

FIG.13.png

CLCC

FIG.14.png

SOJ 32L

FIG.15.png

CNR

Communication and Networking Riser Specification Revision 1.2 

FIG.16.png

SOJ

FIG.17.png

SOP EIAJ TYPE II 14L

FIG.18.png

CPGA

Ceramic Pin Grid Array

FIG.19.png

SOT-220

FIG.20.png

DIP

Dual Inline Package 

FIG.21.20180723.png

SSOP 16L

FIG.22.20180723.png

DIP-tab

Dual Inline Package with Metal Heatsink

FIG.23.20180723.png

SSOP

FIG.24.20180723.png

FBGA

FIG.25.20180723.png

TO-18

FIG.26.20180723.png

FDIP

FIG.27.20180723.png

TO-220

FIG.28.20180723.png

FTO-220

FIG.29.20180723.png

Flat Pack

FIG.30.20180723.png

TO-247

FIG.31.20180723.png

HSOP-28

FIG.32.20180723.png

TO-264

FIG.33.20180723.png

ITO-220

FIG.34.20180723.png

TO-3

FIG.35.20180723.png

ITO-3p

FIG.36.20180723.png

TO-5

FIG.37.20180723.png

JLCC

FIG.38.20180723.png

TO-52

FIG.39.20180723.png

LCC

FIG.40.20180723.png

TO-71

FIG.41.20180723.png

LDCC

FIG.42.20180723.png

TO-72

FIG.43.20180723.png

LQFP

FIG.44.20180723.png

TO-78

FIG.45.20180723.png

TO8

FIG.46.20180723.png

PCDIP

FIG.47.20180723.png

PGA

Plastic Pin Grid Array 

FIG.48.20180723.png

TO-92

FIG.49.20180723.png

TO-39

FIG.50.20180723.png

PLCC

FIG.51.20180723.png

TO-99

FIG.52.20180723.png

PQFP

FIG.53.20180723.png

TSOP

Thin Small Outline Package

FIG.54.20180723.png

PSDIP

FIG.55.20180723.png

LQFP 100L

FIG.56.20180723.png

TSSOP or TSOP II

Thin Shrink 

FIG.57.20180723.png

METAL QUAD 100L

FIG.58.20180723.png

uBGA

Micro Ball Grid Array

FIG.59.20180723.png

PQFP 100L

FIG.60.20180723.png

uBGA

Micro Ball Grid Array

FIG.61.20180723.png

QFP

Quad Flat Package

FIG.63.20180723.png

SOT-220

FIG.64.20180723.png

ZIP

Zig-Zag Inline Package

FIG.65.20180723.png

SOT-223

FIG.66.20180723.png

SOT-223

FIG.67.20180723.png

C-Bend Lead 

FIG.68.20180723.png

SOT-23

FIG.69.20180723.png

CERQUAD

Ceramic Quad Flat Pack

FIG.70.20180723.png

SOT-23/SOT-323

FIG.71.20180723.png

Ceramic Case

FIG.72.20180723.png

SOT-25/SOT-353

FIG.73.20180723.png

LAMINATE CSP 112L

Chip Scale Package

FIG.74.20180723.png

SOT-26/SOT-363

FIG.75.20180723.png

Gull Wing Leads

FIG.76.20180723.png

SOT-343

FIG.77.20180723.png

LLP 8La

FIG.78.20180723.png

SOT-523

FIG.79.20180723.png

SOT89

FIG.81.20180723.png

SOT-89

FIG.85.20180723.png

LAMINATE TCSP 20L

Chip Scale Package

FIG.80.20180723.png

PCI 32bit 5V

Peripheral Component Interconnect

FIG.82.20180723.pngPCI 64bit 3.3V
FIG.89.20180723.png

SIMM30

Single In-line Memory Module

FIG.92.20180723.png

SIMM72

Single In-line Memory Module

FIG.96.20180723.png

SLOT 1

For intel Pentium II Pentium III & Celeron CPU

FIG.98.20180723.png

SLOT A

For AMD Athlon CPU

FIG.83.20180723.png

Socket 603

Foster

FIG.84.20180723.png

PCMCIA

FIG.86.20180723.png

PDIP

FIG.87.20180723.png

PLCC

FIG.88.20180723.png

TO-252

FIG.90.20180723.png

TO-263/TO-268

FIG.91.20180723.png

SO DIMM

Small Outline Dual In-line Memory Module

FIG.93.20180723.png

SOCKET 370

For intel 370 pin PGA Pentium III & Celeron CPU

FIG.95.20180723.png

SOCKET 423

For intel 423 pin PGA Pentium 4 CPU

FIG.97.20180723.png

SOCKET 462/SOCKET A

For PGA AMD Athlon & Duron CPU

FIG.99.20180723.png

SNAPTK

FIG.100.20180723.png

SOCKET 7

For intel Pentium & MMX Pentium CPU

FIG.101.20180723.png

SNAPTK

FIG.102.20180723.png

SNAPZP

FIG.103.20180723.png

SOH

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Ordering & Quality

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FLC10-200H  Datasheet 		In Stock:5153
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PMEG3030EP-115 MAX6804US29D2+T Company:Maxim Integrated Remark:Processor Supervisor 2.93V 2.85V to 5V 4-Pin(3+Tab) SOT-143 T/R Package:TO-253-4, TO-253AA
MAX6804US29D2+T  Datasheet 		In Stock:8225
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PMEG3030EP-115 MC9S12D32MFVE Company:Freescale Remark:MCU 16-bit HCS12 CISC 32KB Flash 2.5V/5V Automotive 80-Pin PQFP Tray Package:QFP
MC9S12D32MFVE  Datasheet 		In Stock:74
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PMEG3030EP-115 MC33910G5AC Company:NXP Remark:IC SYSTEM BASIS CHIP 32LQFP Package:32-LQFP
MC33910G5AC  Datasheet 		In Stock:5153
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PMEG3030EP-115 DS1818-10 Company:Maxim Integrated Remark:IC 2.88V W/PB 10% TO92-3 Package:TO-226-3, TO-92-3 (TO-226AA)
DS1818-10  Datasheet 		In Stock:1150
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PMEG3030EP-115 MC14600P Company:Freescale Semiconductor - NXP Remark:IC ALARM GENERAL MONO 16-DIP Package:16-DIP (0.300", 7.62mm)
MC14600P  Datasheet 		In Stock:1177
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PMEG3030EP-115 RB400DT146 Company:Rohm Semiconductor Remark:DIODE SCHOTTKY 40V 500MA SMD3 Package:TO-236-3, SC-59, SOT-23-3
RB400DT146  Datasheet 		In Stock:9266
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