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LFE2-6SE-5FN256C

Product Category: Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer: Lattice Semiconductor
Description: IC FPGA 190 I/O 256BGA
  datasheetLFE2-6SE-5FN256C  Datasheet
Package: 256-BGA
Quantity: 270 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
Click buy button to purchase: Buy
PRODUCT DETAILS

CAD Models

LFE2-6SE-5FN256C   Symbol

LFE2-6SE-5FN256C   Symbol

LFE2-6SE-5FN256C   Footprint

LFE2-6SE-5FN256C   Footprint


Lifecycle Status Indicator

LFE2-6SE-5FN256C  Lifecycle Status Indicator

LFE2-6SE-5FN256C  Lifecycle Status Indicator


Product Attributes

Manufacturer

Lattice Semiconductor Corporation

Product Category

Embedded - FPGAs (Field Programmable Gate Array)

Series

ECP2

Status

Active

Brand

Lattice

Lead Free

Lead Free

REACH Compliant

Yes

EU RoHS Compliant

Yes

China RoHS Compliant

Yes

Combinatorial Delay of a CLB-Max

0.358 ns

Dedicated DSP

3

Device Number of DLLs/PLLs

2+0+2

GMACs

3.9

HTSUSA

8542390001

JESD-30 Code

S-PBGA-B256

JESD-609 Code

e1

Mounting Style

SMD/SMT

Mounting Type

Surface Mount

Maximum Operating Temperature

85 °C

Minimum Operating Temperature

0 °C

Maximum Reflow Temperature

250 °C

Maximum Voltage Supply

1.26 V

Normal Supply Voltage

1.2 V

Minimum Voltage Supply

1.14 V

Maximum Operating  Frequency

311 MHz

Maximum Distributed RAM Bits

12288

Maximum Differential I/O Pairs

95

Maximum I/O Performance

3.125 Gbps

Mega Multiply Accumulates per second

3900

Memory Size

67 Kb

Number of I/Os

100

Number of I/O Banks

8

Number of Logic Blocks (LABs)

750

Number of Logic Elements/Cells

6000

Number of Pins

256

Number of Multipliers

12 (18x18)

Embedded Memory

55 Kbit

Total Number of Block RAM

3

Number of Inputs

190

Number of Outputs

190

Package / Case

256-BGA

Packaging

Tray

Mfr Package Description

17 X 17 MM, LEAD FREE, FPBGA-256

Package Length

17 mm

Package Width

17 mm

PackageHeight

1.2 mm

Seated Plane Height

1.7 mm

PCB changed

256

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Power Supplies

1.2

Process Technology

90 nm

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Program Memory Type

SRAM

RAM Size

55296b

Shift Registers

Utilize LUT

Speed Grade

5

Subcategory

Programmable Logic ICs

Supplier Device Package

256-FPBGA (17x17)

Tradename

LatticeEC

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

1.0 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30


Features

 High Logic Density for System Integration

• 6K to 95K LUTs

• 90 to 583 I/Os

 Embedded SERDES (LatticeECP2M Only)

• Data Rates 250 Mbps to 3.125 Gbps

• Up to 16 channels per device PCI Express, Ethernet (1GbE, SGMII), OBSAI, CPRI and Serial RapidIO.

 sysDSP™ Block

• 3 to 42 blocks for high performance multiply and accumulate

• Each block supports – One 36x36, four 18x18 or eight 9x9 multipliers

 Flexible Memory Resources

• 55Kbits to 5308Kbits sysMEM™ Embedded Block RAM (EBR)

– 18Kbit block

– Single, pseudo dual and true dual port

– Byte Enable Mode support

• 12K to 202Kbits distributed RAM

– Single port and pseudo dual port

 sysCLOCK Analog PLLs and DLLs

• Two GPLLs and up to six SPLLs per device

– Clock multiply, divide, phase & delay adjust

– Dynamic PLL adjustment

• Two general purpose DLLs per device

 Pre-Engineered Source Synchronous I/O

• DDR registers in I/O cells

• Dedicated gearing logic

• Source synchronous standards support

– SPI4.2, SFI4 (DDR Mode), XGMII

– High Speed ADC/DAC devices

• Dedicated DDR and DDR2 memory support

– DDR1: 400 (200MHz) / DDR2: 533 (266MHz)

• Dedicated DQS support n

 Programmable sysI/O™ Buffer Supports Wide Range Of Interfaces

• LVTTL and LVCMOS 33/25/18/15/12

• SSTL 3/2/18 I, II

• HSTL15 I and HSTL18 I, II

• PCI and Differential HSTL, SSTL

• LVDS, RSDS, Bus-LVDS, MLVDS, LVPECL n

 Flexible Device Configuration 

• 1149.1 Boundary Scan compliant

• Dedicated bank for configuration I/Os

• SPI boot flash interface

• Dual boot images supported

• TransFR™ I/O for simple field updates

• Soft Error Detect macro embedded n

 Optional Bitstream Encryption (LatticeECP2/M “S” Versions Only) n ◆ System Level Support

• ispTRACY™ internal logic analyzer capability

• On-chip oscillator for initialization & general use

• 1.2V power supply


Overview

The LatticeECP2/M family of FPGA devices is optimized to deliver high performance features such as advanced DSP blocks, high speed SERDES (LatticeECP2M family only) and high speed source synchronous interfaces in an economical FPGA fabric. This combination was achieved through advances in device architecture and the use of 90nm technology.

The LatticeECP2/M FPGA fabric is optimized with high performance and low cost in mind. The LatticeECP2/M devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source synchronous I/O support, enhanced sysDSP blocks and advanced configuration support, including encryption (“S” versions only) and dual boot capabilities.

The LatticeECP2M device family features high speed SERDES with PCS. These high jitter tolerance and low transmission jitter SERDES with PCS blocks can be configured to support an array of popular data protocols including PCI Express, Ethernet (1GbE and SGMII), OBSAI and CPRI. Transmit Pre-emphasis and Receive Equalization settings make SERDES suitable for chip to chip and small form factor backplane applications.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

 There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN

EAR99

USHTS

8542310001

CAHTS

8542310000

CNHTS

8542310000

MXHTS

85423199

TARIC

8542319000


Documents & Media

Datasheet

LatticeECP2/M Family Handbook


Product Manufacturer

Lattice Semiconductor (NASDAQ: LSCC) is the global leader in smart connectivity solutions, providing market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The Company¹s broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

Lattice was founded in 1983 and is headquartered in Portland, Oregon. The Company acquired Silicon Image in March 2015, which is a leader in setting industry standards including the highly successful HDMI®, DVI, MHL® and WirelessHD® standards.


Product Range

iCE40 Ultra/UltraLite

iCE40 UltraPlus

iCE40 LP/HX/LM

MachXO3

LatticeXP2

ispMACH 4000ZE

ECP5 & ECP5-5G

LatticeECP3

LatticeECP2/M

Lattice Diamond

Lattice Radiant

ispLEVER Classic


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

270

Lattice Semiconductor Corporation

IC FPGA 190 I/O 256BGA

DigiKey

1890

Lattice Semiconductor Corporation

IC FPGA 190 I/O 256FBGA

Mouser 

90

Lattice

FPGA - Field Programmable Gate Array 6K LUTs 190 I/O S-Ser DSP 1.2V -5


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

LFE2-6SE-5FN256C   Popularity by Region

LFE2-6SE-5FN256C   Popularity by Region


Market Price Analysis

LFE2-6SE-5FN256C   Market Price Analysis

LFE2-6SE-5FN256C   Market Price Analysis

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