| Manufacturer Part#: | MCIMX353DJQ5C |
| Product Category: | Embedded - Microprocessors |
| Manufacturer: | NXP / Freescale |
| Description: | IC MPU I.MX35 532MHZ 400MAPBGA |
 MCIMX353DJQ5C Datasheet |
|
| Package: | 400-LFBGA |
| Quantity: | 24833 PCS |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| one to seven days | |
| Click buy button to purchase: | Buy |
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - Microprocessors |
EU RoHS Compliant | Yes |
Series | i.MX35 |
Status | Active |
Package Description | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400 |
Application | Multimedia Applications |
Base Part Number | MCIMX353 |
Core Processor | ARM1136JF-S |
Contact Plating | Copper, Tin, Silver |
Core Architecture | ARM |
Co-Processors/DSP | Multimedia; GPU, IPU, VFP |
Data Bus Width | 32b |
Display & Interface Controllers | Keypad, KPP, LCD |
Data ROM Size | 32 kB |
Data RAM Size | 128 kB |
Ethernet | 10/100Mbps (1) |
Frequency | 532MHz |
Graphics Acceleration | Yes |
Interface | I2C, SPI, USB, CAN, Ethernet, MMC, UART, USART, EBI/EMI |
I/O Voltage | 1.75 V to 3.6 V |
JESD-30 Code | S-PBGA-B400 |
JESD-609 Code | e1 |
L2 Cache Instruction / Data Memory | 128 kB |
L1 Cache Instruction Memory | 16 kB |
L1 Cache Data Memory | 16 kB |
Memory Type | L1/L2 Cache, ROM, SRAM |
Moisture Sensitive | Yes |
Max Supply Voltage | 1.47V |
Memory Size | 32KB |
Memory Type | SRAM, ROM, L2 Cache |
Min Supply Voltage | 1.33V |
Max Processing Temp | 260 |
Mount | Surface Mount |
Maximum Clock Frequency | 532 MHz |
Number of Cores/Bus Width | 1 Core, 32-Bit |
Number of Timers/Counters | 1 |
Number of Terminals | 400 |
SATA | - |
USB | USB 2.0 + PHY (2) |
Number of Pins | 400 |
Operating Temperature | -20°C ~ 70°C (TA) |
Operating Supply Voltage | 1.33 V to 1.47 V |
Package Quantity | 450 |
Product Dimensions | 17 x 17 x 1.18 mm |
Packaging | Tray |
Product Type | Processors - Application Specialized |
Processor Series | i.MX353 |
Package / Case | 400-LFBGA |
Supplier Device Package | 400-MAPBGA (17x17) |
Package Body Material | PLASTIC/EPOXY |
Package Code | LFBGA |
Package Shape | SQUARE |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | 260 |
Qualification Status | Not Qualified |
RAM Controllers | LPDDR, DDR2 |
RAM Size | 128 kB |
RAM (words) | 128,000 |
Rohs Code | Yes |
Risk Rank | 1.77 |
Speed | 532 MHz |
Surface Mount | Yes |
Seated Height-Max | 1.6 mm |
Security Features | Secure Fusebox, Secure JTAG, Tamper Detection |
Subcategory | Processors - Application Specialized |
Temperature Grade | COMMERCIAL |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 40 |
Length | 17.0 mm |
Width | 17.0 mm |
Tradename | i.MX |
Watchdog Timer | 1 |
Voltage - I/O | 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V |
Additional Interfaces | 1-Wire, ASRC, ATA, CAN, I²C, I²S, MMC/SDIO, SAI, SPI, SSI, UART |
Additional Feature | IT ALSO OPERATES AT 1.22 TO 1.47 V |
uPs/uCs/Peripheral ICs Type | MULTIFUNCTION PERIPHERAL |
Overview
The ARM11-based i.MX353 multimedia applications processors is targeted for consumer and industrial applications. To reduce the BOM costs it is packed with connectivity options including UARTs, SPIs, Ethernet, two Controller Area, Network (CAN) modules, two USB ports with integrated PHYs, ESAI and three MMC/SD/SDIO ports. The i.MX353 has the ability to connect to external wireless modules via a USB or SDIO port and supports external storage via CE-ATA or PATA. Support for cost-effective memory options like DDR2 and multi-level cell NAND reduce system costs and provide the design engineer great flexibility. The i.MX353 is supported by companion Freescale power management ICs (PMIC), MC13892 and MMPF0100.
Features
ARM1136JF-S™
532 MHz maximum speed
128 KB Integrated SRAM
16 KB I/D L1 Cache, 128 KB L2 cache
Image Processing Unit (IPU)
LCD Controller
10/100 Ethernet
MAC 2 x FlexCan modules
HS OTG + PHY, HS Host + PHY
3 x UART, 2 x CSPI, 3 I2C, 2 SSI/I2S
P-ATA/CE-ATA
Optimized for up to 24-bit-per-pixel WVGA
CMOS/CCD sensor interface
Vector Floating Point Unit
External memory interface: mSDRAM/SDRAM, mDDR/DDR2, NOR, SLC/MLC NAND
3.3V general purpose I/O
Advantages and Disadvantages
There is no relevant information available for this part yet.
Applications
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Compliance
RoHS | Compliant |
Radiation Hardening | No |
REACH SVHC | No SVHC |
ECCN / UNSPSC
Description | Value |
ECCN | 5A992 |
HTSN | 8542310001 |
SCHEDULE B | 8542310000 |
Documents & Media
Datasheets | |
Environmental Information |
Product Manufacturer
NXP Semiconductors N.V. is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.
Product Range
Integrated Circuits (ICs) | Microcontrollers - MCU | 8 Bit Microcontrollers - MCU |
Semiconductors | Embedded Processors & Controllers | Microcontrollers - MCU |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 24833 PCS | NXP Semiconductors | IC MPU I.MX35 532MHZ 400MAPBGA |
DigiKey | 719 PCS | NXP Semiconductors | IC MPU I.MX35 532MHZ 400MAPBGA |
Mouser | 130 PCS | NXP Semiconductors | Processors - Application Specialized RINGO MX35 TO2.1 |
Arrow | 69 PCS | NXP Semiconductors | SOC i.MX35 ARM1136JF-S 0.09um 400-Pin MAP-BGA Tray |
Alternative Models
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Popularity by Region
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Market Price Analysis
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