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Product Attributes

Overview

The i.MX 6Solo/6DualLite processors represent Freescale Semiconductor’s latest achievement in integrated multimedia-focused products offering high performance processing with lower cost, as well as optimization for low power consumption. The processors feature Freescale’s advanced implementation of single/dual ARM Cortex -A9 core, which operates at speeds of up to 1 GHz. They include 2D and 3D graphics processors, 1080p video processing, and integrated power management. Each processor provides a 32/64-bit DDR3/LVDDR3/LPDDR2-800 memory interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth , GPS, hard drive, displays, and camera sensors.

Features

The i.MX 6Solo supports single ARM Cortex-A9 MPCore (with TrustZone)

The i.MX 6DualLite supports dual ARM Cortex-A9 MPCore (with TrustZone)

The core configuration is symmetric, where each core includes:

32 KByte L1 Instruction Cache

32 KByte L1 Data Cache

Private Timer and Watchdog

Cortex-A9 NEON MPE (Media Processing Engine) Co-processor The ARM Cortex-A9 MPCore™ complex includes:

General Interrupt Controller (GIC) with 128 interrupt support

Global Timer

Snoop Control Unit (SCU)

512 KB unified I/D L2 cache:

Used by one core in i.MX 6Solo

Shared by two cores in i.MX 6DualLite

Two Master AXI bus interfaces output of L2 cache

Frequency of the core (including NEON and L1 cache).

NEON MPE coprocessor

SIMD Media Processing Architecture

NEON register file with 32x64-bit general-purpose registers

NEON Integer execute pipeline (ALU, Shift, MAC)

NEON dual, single-precision floating point execute pipeline (FADD, FMUL)

NEON load/store and permute pipeline The SoC-level memory system consists of the following additional components:

Boot ROM, including HAB (96 KB)

Internal multimedia / shared, fast access RAM (OCRAM, 128 KB)

Secure/non-secure RAM (16 KB)

External memory interfaces: The i.MX 6Solo/6DualLite processors support latest, high volume, cost effective handheld DRAM, NOR, and NAND Flash memory standards.

16/32-bit LP-DDR2-800, 16/32-bit DDR3-800 and LV-DDR3-800 in i.MX 6Solo; 16/32/64-bit

LP-DDR2-800, 16/32/64-bit DDR3-800 and LV-DDR3-800, supporting DDR interleaving
mode for 2x32 LPDDR2-800 in i.MX 6DualLite

8-bit NAND-Flash, including support for Raw MLC/SLC, 2 KB, 4 KB, and 8 KB page size, BA-NAND, PBA-NAND, LBA-NAND, OneNAND™ and others. BCH ECC up to 40 bit.

16/32-bit NOR Flash. All WEIMv2 pins are muxed on other interfaces.

16/32-bit PSRAM, Cellular RAM Each i.MX 6Solo/6DualLite processor enables the following interfaces to external devices (some of them are muxed and not available simultaneously):

Displays-Total of five interfaces available. Total raw pixel rate of all interfaces is up to 450 Mpixels/sec, 24 bpp. Up to two interfaces may be active in parallel (excluding EPDC).

One Parallel 24-bit display port, up to 225 Mpixels/sec (for example, WUXGA at 60 Hz or dual HD1080 and WXGA at 60 Hz)

LVDS serial ports-One port up to 165 Mpixels/sec or two ports up to 85 MP/sec (for example, WUXGA at 60 Hz) each

HDMI 1.4 port

MIPI/DSI, two lanes at 1 Gbps

EPDC, Color, and monochrome E-INK, up to 1650x2332 resolution and 5-bit grayscale

Camera sensors:

Two parallel Camera ports (up to 20 bit and up to 240 MHz peak)

MIPI CSI-2 Serial port, supporting from 80 Mbps to 1 Gbps speed per data lane. The CSI-2 Receiver core can manage one clock lane and up to two data lanes. Each i.MX 6Solo/6DualLite processor has two lanes.

Expansion cards:

Four MMC/SD/SDIO card ports all supporting:

1-bit or 4-bit transfer mode specifications for SD and SDIO cards up to UHS-I SDR-104 mode (104 MB/s max)

1-bit, 4-bit, or 8-bit transfer mode specifications for MMC cards up to 52 MHz in both SDR and DDR modes (104 MB/s max)

USB:

One high speed (HS) USB 2.0 OTG (Up to 480 Mbps), with integrated HS USB Phy

Three USB 2.0 (480 Mbps) hosts:

One HS host with integrated High Speed Phy

Two HS hosts with integrated HS-IC USB (High Speed Inter-Chip USB) Phy

Expansion PCI Express port (PCIe) v2.0 one lane

PCI Express (Gen 2.0) dual mode complex, supporting Root complex operations and Endpoint operations. Uses x1 PHY configuration.

Advantages and Disadvantages

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Compliance

ECCN / UNSPSC

Documents & Media

Product Manufacturer

NXP Semiconductors N.V. is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.

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