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Manufacturer Part#:

MCF5206ECAB40

Product Category: Embedded - Microcontrollers
Manufacturer: Freescale Semiconductor - NXP
Description: IC MCU 32BIT 160QFP
  datasheetMCF5206ECAB40  Datasheet
Package: QFP160
Quantity: 1276 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
Click buy button to purchase: Buy
PRODUCT DETAILS

CAD Models

MCF5206ECAB40   Footprint

MCF5206ECAB40   Footprint


Product Attributes

Manufacturer

Freescale

Product Category

Embedded - Microcontrollers

Series

MCF520x

Brand

NXP / Freescale

Boundary Scan

YES

Core Processor

Coldfire V2

Core Size

32-Bit

Contact Plating

Tin, Matte

Core Architecture

Coldfire

Connectivity

EBI/EMI, I2C, UART/USART

External Data Bus Width

32

Data-RAM-Size

512 B

Format

FIXED POINT

Interface Type

Parallel UART

Instruction Cache Size

4KB

Instruction Set Architecture

RISC

JESD-30 Code

S-PQFP-G160

JESD-609 Code

e3

L1-Cache-Instruction-Memory

512 B

Microprocessor/Microcontroller/Peripheral IC Type

MICROPROCESSOR, RISC

Mounting Style

SMD/SMT

Mounting Type

Surface Mount

Maximum Operating Temperature

85 °C

Minimum Operating Temperature

-40 °C

Maximum Clock Frequency

40 MHz

Maximum Supply Voltage

5.25 V

Minimum Supply Voltage

4.75 V

Typical Operating Supply Voltage

3.3 V

Memory Size

512 B

Memory Type

ROMless

Maximum Reflow Temperature

245 °C

Reflow Solder Time (Sec)

30

Number of Reflow Cycle

3

Number-of-Cores

1

Number of I/Os

8

Number-of-Timers-Counters

2 x 16 bit

Number of Pins

160

Oscillator Type

External

Packaging

Tray

Package / Case

160-BQFP

Mfr Package Description

28 X 28 MM, 3.30 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-160

Package Body Material

PLASTIC/EPOXY

Package Code

QFP

Package Equivalence Code

QFP160,1.2SQ

Package Shape

SQUARE

Package Style

FLATPACK

Peak Reflow Temperature

245 °C

PCB changed

160

Peripherals

DMA, WDT

Processor Series

ColdFire

Process Technology

0.35 um

RAM Size

512 B

Speed

40 MHz

Supplier Device Package

160-QFP (28x28)

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Matte Tin (Sn)

Terminal Form

GULL WING

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max

30 s

Tradename

ColdFire

Product Dimensions

28 x 28 x 3.5 mm

Length

28 mm

Width

28 mm

Height

3.5(Max) mm

Seated Plane Height

3.85(Max) mm

Sub Category

Microprocessors

Pin Pitch

0.65 mm

Unit-Weight

0.196363 oz

Lead Finish(Plating)

Matte Sn annealed

Terminal Base Material

Cu Alloy


Overview

The MCF5206e integrated microprocessor combines a ColdFire V2 core with several peripheral functions such as a DRAM controller, timers, parallel and serial interfaces and system integration. This device is an enhanced version of the MCF5206. Not only does the MCF5206e provide a performance upgrade to the MCF5206 due to the increased 4 KB I-cache and 8 KB SRAM and increased frequency, but it also integrates an additional multiply-accumulate module (MAC), hardware divide and two-channel direct memory access (DMA) to the device while maintaining pin compatibility with the MCF5206.


Features

● ColdFire V2 Core

● MAC and divide unit

● 4 KB direct-mapped instruction cache

● 8 KB on-chip SRAM

● DRAM controller, supports EDO and page node DRAMs

● 2-channel DMA controller

● Two universal synchronous/asynchronous receiver/transmitters (UART)

● Dual 16-bit general-purpose multimode timers

● I²C compatible bus

● System interface

● System debug support

● Fully static 3.3-volt operation with 5-volt tolerant inputs

● 160-pin QFP package pin-compatible with MCF5206

● 8-bit general purpose parallel I/O port

● 50 MIPS at 54 MHz

● Available at 40 and 50 MHz


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

 There is no relevant information available for this part yet.


Compliance

Halogen Free

Not Halogen Free

Lead Free

Lead Free

REACH SVHC

No SVHC

Radiation Hardening

No

RoHS

Compliant


ECCN / UNSPSC

Description

Value

ECCN

3A991.A.2

HTSN

8542310001

SCHEDULE B

8542310000


Documents & Media

Datasheet

MCF5206ECAB40 Datasheet

Test/Quality Data

Material Composition

Statement on EU REACH Provisions

Application-Note

Solder Joint Temperature and Package Peak Temperature

AN2005 Embedded ColdFire Taking Linux On-Board

App-Notes for AN2006

Other-Documents

MCF5XXXDBWP Debug Support on the ColdFire Architecture

Technical-Specifications

QFP 160 28*28*3.3P0.65

MCF5206E Integrated Microprocessor Product Brief

MCF5206e Microprocessor Fact Sheet

Errata-Sheets

Errata for MCF5206ECE

User-Guides

Errata to MCF5206e ColdFire Microprocessor User Manual

ColdFire Family Programmer's - Reference Manual


Product Manufacturer

NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries.


Product Range

ARM ® PROCESSORS

ANALOG

POWER ARCHITECTURE ®PROCESSORS

MEDIA AND AUDIO

RF

IDENTIFICATION & SECURITY

Sensors

Wireless

Automotive Products


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

1276

Freescale

IC MCU 32BIT 160QFP

DigiKey

99

NXP USA Inc.

IC MCU 32BIT ROMLESS 160QFP

Mouser

1126

NXP / Freescale

Microprocessors - MPU MCF5206E V2CORE

Avnet

0

NXP

MPU MCF5xxx RISC 32-Bit 0.35um 40MHz 3.3V 160-Pin PQFP Tray


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

MCF5206ECAB40   Popularity by Region

MCF5206ECAB40   Popularity by Region


Market Price Analysis

MCF5206ECAB40   Market Price Analysis

MCF5206ECAB40   Market Price Analysis


Pictures

MCF5206ECAB40MCF5206ECAB40 IIMCF5206ECAB40 III

MCF5206ECAB40  Images

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