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XC7VX485T-3FFG1157E

Product Category: IC chips
Manufacturer: Xilinx
Description: IC FPGA 600 I/O 1157FCBGA
  datasheetXC7VX485T-3FFG1157E  Datasheet
Package: BGA
Quantity: 88 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
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PRODUCT DETAILS

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Product Attributes

Manufacturer

Xilinx Inc.

Product Category

IC Chips

Series

VirtexR-7

Status

Active

Family Name

Virtex®-7 XT

Combinatorial Delay of a CLB-Max

0.58 ns

REACH Compliant

Yes

EU RoHS Compliant

Yes

Device Logic Cells

485,760

Device Logic Units

303,600

Device Number of DLLs/PLLs

14

Dedicated DSP

2800

JESD-30 Code

S-PBGA-B1157

JESD-609 Code

e1

Lead Shape

Ball

Lead Finish(Plating)

SnAgCu

Mounting Type

Surface Mount

Max Operating Temperature

100 °C

Min Operating Temperature

0 °C

Maximum Reflow Temperature

245 °C

Maximum Operating Supply Voltage

1.03 V

Typical Operating Supply Voltage

1 V

Minimum Operating Supply Voltage

0.97 V

Maximum Clock Frequency

1818 MHz

Number of I/Os

600

Number of Inputs

600

Number of Outputs

600

Number of Logic Blocks (LABs)

37950

Number of Logic Elements/Cells

485760

Number of Multipliers

2800 (25x18)

Number of Registers

607200

Organization

37950 CLBS

Package / Case

1156-BBGA, FCBGA

Mfr Package Description

FBGA-1157

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA1156,34X34,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Package Length

35 mm

Package Width

35 mm

Package Height

2.75(Max) mm

Seated Plane Height

3.35(Max) mm

Pin Pitch

1 mm

PCI Blocks

4

Pin Count

1157

PCB

1157

Process Technology

28 nm

Program Memory Type

SRAM

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

RAM Size

37969920b

Re-programmability Support

1

Screening Level

Extended

Speed Grade

3

Sub Category

Field Programmable Gate Arrays

Supplier Device Package

1157-FCBGA (35x35)

Total Number of Block RAM

1030

Technology

CMOS

Temperature Grade

MILITARY

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Position

BOTTOM

Transceiver Blocks

56

Transceiver Speed

28.05 Gbps


Overview

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:

 Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.

 Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

 Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance.

 Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Features

Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

 There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991D

HTSN

8542390001"

SCHEDULE B

8542390000"


Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known as the semiconductor company that invented the field-programmable gate array (FPGA) and created the first fabless manufacturing model.

Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

 

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

88

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

DigiKey

0

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Avnet

0

Xilinx

FPGA Virtex-7 XT Family 485760 Cells 28nm Technology 1V 1157-Pin FC-BGA


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 XC7VX485T-3FFG1157E   Popularity by Region

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Market Price Analysis

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