Manufacturer Part#: | XC7VX485T-3FFG1157E |
Product Category: | IC chips |
Manufacturer: | Xilinx |
Description: | IC FPGA 600 I/O 1157FCBGA |
XC7VX485T-3FFG1157E  Datasheet | |
Package: | BGA |
Quantity: | 88 PCS |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
one to seven days | |
Click buy button to purchase: | Buy |
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Product Attributes
Manufacturer | Xilinx Inc. |
Product Category | IC Chips |
Series | VirtexR-7 |
Status | Active |
Family Name | Virtex®-7 XT |
Combinatorial Delay of a CLB-Max | 0.58 ns |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Device Logic Cells | 485,760 |
Device Logic Units | 303,600 |
Device Number of DLLs/PLLs | 14 |
Dedicated DSP | 2800 |
JESD-30 Code | S-PBGA-B1157 |
JESD-609 Code | e1 |
Lead Shape | Ball |
Lead Finish(Plating) | SnAgCu |
Mounting Type | Surface Mount |
Max Operating Temperature | 100 °C |
Min Operating Temperature | 0 °C |
Maximum Reflow Temperature | 245 °C |
Maximum Operating Supply Voltage | 1.03 V |
Typical Operating Supply Voltage | 1 V |
Minimum Operating Supply Voltage | 0.97 V |
Maximum Clock Frequency | 1818 MHz |
Number of I/Os | 600 |
Number of Inputs | 600 |
Number of Outputs | 600 |
Number of Logic Blocks (LABs) | 37950 |
Number of Logic Elements/Cells | 485760 |
Number of Multipliers | 2800 (25x18) |
Number of Registers | 607200 |
Organization | 37950 CLBS |
Package / Case | 1156-BBGA, FCBGA |
Mfr Package Description | FBGA-1157 |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Equivalence Code | BGA1156,34X34,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Package Length | 35 mm |
Package Width | 35 mm |
Package Height | 2.75(Max) mm |
Seated Plane Height | 3.35(Max) mm |
Pin Pitch | 1 mm |
PCI Blocks | 4 |
Pin Count | 1157 |
PCB | 1157 |
Process Technology | 28 nm |
Program Memory Type | SRAM |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
RAM Size | 37969920b |
Re-programmability Support | 1 |
Screening Level | Extended |
Speed Grade | 3 |
Sub Category | Field Programmable Gate Arrays |
Supplier Device Package | 1157-FCBGA (35x35) |
Total Number of Block RAM | 1030 |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL |
Terminal Position | BOTTOM |
Transceiver Blocks | 56 |
Transceiver Speed | 28.05 Gbps |
Overview
Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:
● Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.
● Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
● Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance.
● Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Features
● Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
● 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
● High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
● High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
● A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
● DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
● Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
● Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
● Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
● Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
● Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
Advantages and Disadvantages
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991D |
HTSN | 8542390001" |
SCHEDULE B | 8542390000" |
Product Manufacturer
Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known as the semiconductor company that invented the field-programmable gate array (FPGA) and created the first fabless manufacturing model.
Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs
| System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 88 | Xilinx Inc. | IC FPGA 600 I/O 1157FCBGA |
DigiKey | 0 | Xilinx Inc. | IC FPGA 600 I/O 1157FCBGA |
Avnet | 0 | Xilinx | FPGA Virtex-7 XT Family 485760 Cells 28nm Technology 1V 1157-Pin FC-BGA |
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